The investigation of the capillary flow of underfill materials

By Huang C.Y.  

Microelectronics International, Vol. 19, Iss. 1, 2002-04 ,pp. : 23-29

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Cure behavior of a no flow underfill encapsulant

By Hsu D.T.   Kim H.K.   Shi F.G.   Tong H.Y.   Chungpaiboonpatana S   Davidson C   Adams J.M.  

Microelectronics International, Vol. 17, Iss. 1, 2000-01 ,pp. : 22-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

By Zhong Zhaowei  

Microelectronics International, Vol. 16, Iss. 3, 1999-12 ,pp. : 6-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

MEMS reliability modelling methodology: application to wobble micromotor failure analysis.

By Muratet S.   Fourniols J.   Soto-Romero G.   Endemano A.   Marty A.   Desmulliez M.  

Microelectronics Reliability, Vol. 43, Iss. 9, 2003-09 ,pp. : 1945-1949

Elsevier

Access to resources Recommend Favorite

Trends in Failure Analysis

By Wagner L.C.  

Microelectronics Reliability, Vol. 43, Iss. 9, 2003-09 ,pp. : 1369-1375

Elsevier

Access to resources Recommend Favorite