Investigation into the curing and thermal behavior of an epoxy-based UV curable coating in microelectronics assembly

Author: Tsang Chi Fo  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.17, Iss.3, 2000-12, pp. : 27-41

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content