Comparison approach on strain behavior of PBGA assembly by considering different thermal-mechanical compound loading modes

Author： Tan Guangbin   Yang Ping   Li Tianbo   Xi Tao   Yuan Xiaoming   Yang Jianming  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.29, Iss.2, 2012-05, pp. : 71-75

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