Test chip and substrate design for flip chip microelectronic package thermal measurements

Author： Goh Teck Joo Chiu Chia-Pin Seetharamu K.N. Quadir G.A. Zainal Z.A.

ISSN： 1356-5362

Source： Microelectronics International, Vol.23, Iss.2, 2006-05, pp. : 3-10

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