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Microelectronics International, Vol. 21, Iss. 2, 2004-02 ,pp. : 29-35

Emerald Group Publishing Ltd

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Test chip and substrate design for flip chip microelectronic package thermal measurements

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Electro-thermal simulation including a temperature distribution inside power semiconductor devices

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International Journal of Electronics, Vol. 92, Iss. 4, 2005-04 ,pp. : 189-213

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Thermal distribution calculations for block level placement in embedded systems

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Optimization of thermal distribution in ceramics and LTCC structures applied to sensor elements

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