Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life

Author： Lee K.O. Ong K.E. Seetharamu K.N. Azid I.A. Quadir G.A. Goh T.J.

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.23, Iss.2, 2006-05, pp. : 37-44

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