Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

By Hacke P.   Sprecher A.   Conrad H.  

Journal of Electronic Materials, Vol. 26, Iss. 7, 1997-07 ,pp. : 774-782

Springer Publishing Company

Access to resources Recommend Favorite

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

By Tee T.Y.   Zhong Z.  

Microelectronics Reliability, Vol. 44, Iss. 1, 2004-01 ,pp. : 105-114

Elsevier

Access to resources Recommend Favorite

Thermal modelling of Ohmic heating microreactors

By Cordero N.   West J.   Berney H.  

Microelectronics, Vol. 34, Iss. 12, 2003-12 ,pp. : 1137-1142

Elsevier

Access to resources Recommend Favorite

Modelling mutual thermal coupling in LED modules

By Górecki Krzysztof   Ptak Przemysław  

Microelectronics International, Vol. 32, Iss. 3, 2015-08 ,pp. : 152-157

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Transient thermo-reflectance measurements of the thermal conductivity and interface resistance of metallized natural and isotopically-pure silicon

By Komarov P.L.   Burzo M.G.   Kaytaz G.   Raad P.E.  

Microelectronics, Vol. 34, Iss. 12, 2003-12 ,pp. : 1115-1118

Elsevier

Access to resources Recommend Favorite