Research on monocrystalline silicon slicing with fixed abrasive diamond wire saw

Author： Ge Peiqi   Meng Jianfeng   Hou Zhijian  

Publisher： Inderscience Publishers

ISSN： 1748-5711

Source： International Journal of Machining and Machinability of Materials, Vol.1, Iss.3, 2006-11, pp. : 333-342

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Slicing alumina with active braze coating diamond wire

By Tso Pei-Lum   Chen Yong-Ting   Chuang Jen-Chen  

International Journal of Abrasive Technology, Vol. 5, Iss. 4, 2012-02 ,pp. : 341-353

Inderscience Publishers

Access to resources Recommend Favorite

Scheduling wafer slicing by multi-wire saw manufacturing in photovoltaic industry: a case study

By Guimarães Luis   Santos Rui   Almada-Lobo Bernardo  

The International Journal of Advanced Manufacturing Technology, Vol. 53, Iss. 9-12, 2011-04 ,pp. : 1129-1139

Springer Publishing Company

Access to resources Recommend Favorite

A case study of silicon wafer slicing

By Chang Che-Wei   Wu Cheng-Ru   Lin Chin-Tsai   Chen Huang-Chu  

International Journal of Nanomanufacturing, Vol. 1, Iss. 3, 2007-05 ,pp. : 321-342

Inderscience Publishers

Access to resources Recommend Favorite

A focused review on nanoscratching-induced deformation of monocrystalline silicon

By Wu Yueqin  

International Journal of Surface Science and Engineering, Vol. 7, Iss. 1, 2013-02 ,pp. : 51-80

Inderscience Publishers

Access to resources Recommend Favorite

Finishing effect of abrasive flow machining on micro slit fabricated by wire-EDM

By Tzeng Hsinn-Jyh   Yan Biing-Hwa   Hsu Rong-Tzong   Chow Han-Ming  

The International Journal of Advanced Manufacturing Technology, Vol. 34, Iss. 7-8, 2007-10 ,pp. : 649-656

Springer Publishing Company

Access to resources Recommend Favorite