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Springer Publishing Company

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Focus groups: impact of quality and process capability factors on the silicon wafer slicing process

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International Journal of Manufacturing Technology and Management, Vol. 6, Iss. 1-2, 2004-05 ,pp. : 171-184

Inderscience Publishers

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The worst ill-conditioned silicon wafer slicing machine detected by using grey relational analysis

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Machining characteristics on the ultra-precision dicing of silicon wafer

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Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresaw

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International Journal of Manufacturing Technology and Management, Vol. 7, Iss. 5-6, 2005-09 ,pp. : 407-429

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