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By Yang Weiping   Wu Yongbo   Kato Masana  

International Journal of Materials and Product Technology, Vol. 31, Iss. 2-3, 2008-04 ,pp. : 159-175

Inderscience Publishers

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The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer

By Arefin S.   Li X.   Rahman M.   Liu K.  

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Springer Publishing Company

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Research on ultrasonically assisted electrochemical machining process

By Skoczypiec Sebastian  

The International Journal of Advanced Manufacturing Technology, Vol. 52, Iss. 5-8, 2011-02 ,pp. : 565-574

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Enhanced finite element model of ultrasonically assisted turning

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International Journal of Machining and Machinability of Materials, Vol. 6, Iss. 1-2, 2009-07 ,pp. : 159-173

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Voltage-assisted polymer wafer bonding

By Varsanik J S   Bernstein J J  

Journal of Micromechanics and Microengineering, Vol. 22, Iss. 2, 2012-02 ,pp. : 25004-25010

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