Electrodeposition of Cu onto Pt in presence of egg ovalbumin

By Bozzini B.   Campbell S. A.   D'Urzo L.  

Transactions of the Institute of Metal Finishing, Vol. 85, Iss. 3, 2007-05 ,pp. : 123-134

Maney Publishing

Access to resources Recommend Favorite

Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS)

By Bozzini B.   D'Urzo L.   Mele C.   Romanello V.  

Transactions of the Institute of Metal Finishing, Vol. 84, Iss. 2, 2006-03 ,pp. : 83-93

Maney Publishing

Access to resources Recommend Favorite

Acid corrosion of iron in the presence of mixtures of anionic additives and compounds of the reaction series of o-hydroxyazomethine derivatives with nucleophilic substituents

By Grigor’ev V.   Boginskaya V.  

Protection of Metals, Vol. 42, Iss. 6, 2006-12 ,pp. : 583-587

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

LIQUID FILM MIGRATION IN A Cu-2.65 at% Cd ALLOY

By YADAV C.K.   GUPTA S.P.  

Canadian Metallurgical Quarterly, Vol. 47, Iss. 2, 2008-01 ,pp. : 205-222

Maney Publishing

Access to resources Recommend Favorite

Aspects of copper electrodeposition from acidic sulphate solutions in presence of thiourea

By Tantavichet N.   Pritzker M. D.  

Transactions of the Institute of Metal Finishing, Vol. 84, Iss. 1, 2006-01 ,pp. : 36-46

Maney Publishing

Access to resources Recommend Favorite