Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresaw

Author: Zhu Liqun   Kao Imin  

Publisher: Inderscience Publishers

ISSN: 1368-2148

Source: International Journal of Manufacturing Technology and Management, Vol.7, Iss.5-6, 2005-09, pp. : 407-429

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Abstract