In-process force monitoring for precision grinding semiconductor silicon wafers

Author: Couey Jeremiah A.   Marsh Eric R.   Knapp Byron R.   Vallance R. Ryan  

Publisher: Inderscience Publishers

ISSN: 1368-2148

Source: International Journal of Manufacturing Technology and Management, Vol.7, Iss.5-6, 2005-09, pp. : 430-440

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