Nano- and micrometer-scale thin-film-interconnection failure theory and simulation and metallization lifetime prediction, Part 2: Polycrystalline-line degradation and bulk failure

Author： Valiev K.   Goldstein R.   Zhitnikov Yu.   Makhviladze T.   Sarychev M.  

Publisher： MAIK Nauka/Interperiodica

ISSN： 1063-7397

Source： Russian Microelectronics, Vol.39, Iss.3, 2010-06, pp. : 145-157

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