Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

By Kato H.   Masaki T.   Kageyama K.  

Materials Science and Technology, Vol. 17, Iss. 10, 2001-10 ,pp. : 1306-1312

Maney Publishing

Access to resources Recommend Favorite

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

By Kato H.   Matsubara K.   Kageyama K.  

Materials Science and Technology, Vol. 19, Iss. 10, 2003-10 ,pp. : 1403-1410

Maney Publishing

Access to resources Recommend Favorite

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

By Yoon J.-W.   Jung S.-B.  

Materials Science and Technology, Vol. 25, Iss. 12, 2009-12 ,pp. : 1478-1484

Maney Publishing

Access to resources Recommend Favorite

Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

By Narayan S   Prabhu K N  

Materials Science and Technology, Vol. 29, Iss. 4, 2013-04 ,pp. : 464-473

Maney Publishing

Access to resources Recommend Favorite

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

By Li F. Q.   Wang C. Q.   Tian Y. H.  

Materials Science and Technology, Vol. 24, Iss. 6, 2008-06 ,pp. : 744-750

Maney Publishing

Access to resources Recommend Favorite