Diffusion bonding between Ti -6Al -4V alloy and microduplex stainless steel with copper interlayer

Author: Eroglu M.   Khan T. I.   Orhan N.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.18, Iss.1, 2002-01, pp. : 68-72

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Abstract