Tensile creep behaviour of coarse grained copper foils at high homologous temperatures and low stresses

Author: Srivastava V.   McNee K. R.   Jones H.   Greenwood G. W.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.21, Iss.6, 2005-06, pp. : 701-707

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Abstract