Constitution of AuSn–Pb–Sn partial ternary system

By Humpston G.   Davies B. L.  

Materials Science and Technology, Vol. 1, Iss. 6, 1985-06 ,pp. : 433-441

Maney Publishing

Access to resources Recommend Favorite

Constitution of Au–AuSn–Pb partial ternary system

By Humpston G.   Evans D. S.  

Materials Science and Technology, Vol. 3, Iss. 8, 1987-08 ,pp. : 621-627

Maney Publishing

Access to resources Recommend Favorite

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

By Li F. Q.   Wang C. Q.   Tian Y. H.  

Materials Science and Technology, Vol. 24, Iss. 6, 2008-06 ,pp. : 744-750

Maney Publishing

Access to resources Recommend Favorite

Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder

By Snugovsky L.   Snugovsky P.   Perovic D. D.   Sack T.   Rutter J. W.  

Materials Science and Technology, Vol. 21, Iss. 1, 2005-01 ,pp. : 53-60

Maney Publishing

Access to resources Recommend Favorite

Reaction processes between silver or zinc doped Pb–Sn solder and gold

By Hall C. R   Hannech EI.-B.  

Materials Science and Technology, Vol. 8, Iss. 10, 1992-10 ,pp. : 930-937

Maney Publishing

Access to resources Recommend Favorite