Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn–xAg–0·5Cu (x: 1, 3 and 4 mass-%) lead free solders

Author: Terashima S.   Tanaka M.  

Publisher: Maney Publishing

ISSN: 1743-2936

Source: Science and Technology of Welding & Joining, Vol.14, Iss.5, 2009-07, pp. : 468-475

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