Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1, 1˙2 and 3) lead free solder interconnects

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Science and Technology of Welding & Joining, Vol. 13, Iss. 1, 2008-01 ,pp. : 60-65

Maney Publishing

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Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn–xAg–0·5Cu (x: 1, 3 and 4 mass-%) lead free solders

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

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Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

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Tin pest in Sn-0.5 wt.% Cu lead-free solder

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JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 39-41

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