Transient liquid phase (TLP) bonding of TiAl using various insert foils

Author: Duan H.   Koçak M.   Bohm K.-H.   Ventzke V.  

Publisher: Maney Publishing

ISSN: 1743-2936

Source: Science and Technology of Welding & Joining, Vol.9, Iss.6, 2004-12, pp. : 513-518

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Abstract