Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

Author: Duan H.   Koçak M.   Bohm K.-H.   Ventzke V.  

Publisher: Maney Publishing

ISSN: 1743-2936

Source: Science and Technology of Welding & Joining, Vol.9, Iss.6, 2004-12, pp. : 525-531

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract