Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

Author: Legois V.   Aucouturier M.   Ollivier E.   Darque-Darque E.   Macheto P.  

Publisher: Maney Publishing

ISSN: 1743-2944

Source: Surface Engineering, Vol.14, Iss.3, 1998-01, pp. : 259-264

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Abstract