Optimising the Drilling and Etch-back Parameters in Flexible Multilayer Manufacture

By Menzel R.  

Circuit World, Vol. 13, Iss. 3, 1993-12 ,pp. : 21-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

P 3 T ‐ a new technology for the cost and resource efficient inline production of flexible printed circuits, RFID antennas and biosensors

By Borris Jochen   Thomas Michael   Dohse Antje   Klages Claus-Peter   Möbius Andreas   Elbick Danica   Prinz Ulrich   Wandner Karl-Heinz   Weidlich Ernst-Rudolf  

Circuit World, Vol. 36, Iss. 4, 2010-11 ,pp. : 18-21

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Two-layer soil model for power station grounding system calculation considering multilayer soil stratification

By Mombello E.   Trad O.   Rivera J.   Andreoni A.  

Electric Power Systems Research, Vol. 37, Iss. 1, 1996-04 ,pp. : 67-78

Elsevier

Access to resources Recommend Favorite

"System in package technology" ‐ design for manufacture challenges

By Richardson Andrew   Bailey Chris   Yanou Jean Marc   Dumas Norbert   Liu Dongsheng   Stoyanov Stoyan   Strusevich Nadia  

Circuit World, Vol. 33, Iss. 1, 2007-02 ,pp. : 36-46

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Analysis and design of rectangular microstrip antenna on two-layer substrate materials at terahertz frequency

By Jha Kumud   Singh G.  

Journal of Computational Electronics, Vol. 9, Iss. 2, 2010-06 ,pp. : 68-78

Springer Publishing Company

Access to resources Recommend Favorite