A New Technology for the Design and Manufacture of Two-layer and Multilayer 'Semi-flexible' Circuits for Automotive Applications

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Circuit World, Vol. 18, Iss. 2, 1993-12 ,pp. : 27-31

Emerald Group Publishing Ltd

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Technology of Manufacture or Technology of Application—Which Will Change More?

By Nicholson E.H.  

Circuit World, Vol. 7, Iss. 4, 1993-12 ,pp. : 39-40

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Challenges in the manufacture of glass substrates for electrical and optical interconnect

By Hutt David A.   Williams Karen   Conway Paul P.   Khoshnaw Fuad M.   Cui Xiaoyun   Bhatt Deepa  

Circuit World, Vol. 33, Iss. 1, 2007-02 ,pp. : 22-30

Emerald Group Publishing Ltd

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Design of a Low-cost Wire Bond Tape Ball Grid Array Package*

By Schueller R D   Plepys A P  

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Challenges for gas technology in a restructured electric industry

By Ban S.D.  

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