A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)

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Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 23-29

Emerald Group Publishing Ltd

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Immersion tin as a high performance solderable finish for fine pitch PWBs

By Ormerod David H  

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Allowable copper thickness for fine pitch patterns formed by a subtractive method

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Circuit World, Vol. 27, Iss. 1, 2001-01 ,pp. : 6-12

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Solder bridging test to evaluate the compatibility for fine-pitch microsoldering

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Analytical and Experimental Studies of 208-pin Fine Pitch (0·5 mm) Quad Flat Pack Solder-joint Reliability

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