A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)

Author： Leneke Thomas   Hirsch Soeren   Schmidt Bertram  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.35, Iss.2, 2009-05, pp. : 23-29

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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