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By Goosey Martin  

Circuit World, Vol. 28, Iss. 3, 2002-03 ,pp. : 36-39

Emerald Group Publishing Ltd

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Thermal cycle reliability of solder joints to alternate plating finishes

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Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

By Hetschel Thomas   Wolter Klaus-Jürgen   Phillipp Fritz  

Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 37-44

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An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

By Vianco Paul T  

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Printed Wiring Design Aspects of Using Permanent Photopolymer (Dry Film Solder Mask) Coatings

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