Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

By Wei G.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

Springer Publishing Company

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Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 115-123

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Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

By Kim Dae-Gon   Jang Hyung-Sun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 8, 2005-08 ,pp. : 523-528

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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

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