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By Chuang C.M.   Lui T.S.   Chen L.H.  

Journal of Materials Science, Vol. 37, Iss. 1, 2002-01 ,pp. : 191-195

Springer Publishing Company

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Effects of addition of copper particles of different size to Sn-3.5Ag solder

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 86-93

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Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

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Sn–Zn low temperature solder

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