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Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 7, 2010-07 ,pp. : 702-707

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Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder

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Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

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Effect of nano-TiO₂ addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

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