Author: Salem M. Ben Rabha M. Bessais B. Elkhakani M. Gaidi M.
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.24, Iss.12, 2013-12, pp. : 5035-5039
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Joining of Silicon Carbide Using MgO-Al2O3-SiO2 Filler
By Lee H.L. Nam S.W. Hahn B.S. Park B.H. Han D.
Journal of Materials Science, Vol. 33, Iss. 20, 1998-10 ,pp. :
By Chartier T. Laurent J.M. Smith D.S. Valdivieso F. Goeuriot P. Thevenot F.
Journal of Materials Science, Vol. 36, Iss. 15, 2001-08 ,pp. :