Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Author： Pan Guoshun Zhou Yan Luo Guihai Shi Xiaolei Zou Chunli Gong Hua

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.24, Iss.12, 2013-12, pp. : 5040-5047

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