Preparation and conductive mechanism of copper nanoparticles ink

Author: Yang Wendong   Liu Chunyan   Zhang Zhiying   Liu Yun   Nie Shidong  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.24, Iss.12, 2013-12, pp. : 5175-5182

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