Solution equilibrium characteristics of electroless copper deposition on thermally-activated palladium-catalysed polyimide substrates

Author: Ramasubramanian M.   Popov B.N.   White R.E.   Chen K.S.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.28, Iss.7, 1998-07, pp. : 737-743

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Abstract