Study of the mechanism of additives on copper dissolution in monoethanolamine-complexed cupric ion solution

Author: Shih C-W.   Wang Y-Y.   Wan C-C.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.32, Iss.9, 2002-09, pp. : 987-992

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Abstract