The influence of backgrinding on the fracture strength of 100 mm diameter (1 1 1) p-type silicon wafers

Author: McGUIRE K.   Danyluk S.   Baker T.L.   Rupnow J.W.   McLAUGHLIN D.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.32, Iss.4, 1997-04, pp. : 1017-1024

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