The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

Author: Jiuchun Yan   Zhiwu Xu   Gaohui Wu   Shiqin Yang  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.19, 2005-10, pp. : 5307-5309

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Abstract