The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

Author： Chang S.  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.23, Iss.1, 2012-01, pp. : 100-107

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