Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

Author： Xia Yanghua Xie Xiaoming Xie Xiaoming Lu Chuanyan

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.41, Iss.8, 2006-04, pp. : 2359-2364

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

By Tian Yanhong

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

Springer Publishing Company

Access to resources Recommend Favorite

Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame

By Haque A.

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 115-123

Springer Publishing Company

Access to resources Recommend Favorite

Formation of bulk Cu₆Sn₅ intermetallic compounds in Sn–Cu lead-free solders during solidification

By Shen J. Liu Y. Gao H.

Journal of Materials Science, Vol. 42, Iss. 14, 2007-07 ,pp. : 5375-5380

Springer Publishing Company

Access to resources Recommend Favorite

Liquidus and Wettablity of Lead-Free Solder Alloys

Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. : 462-465

Trans Tech Publications

Access to resources Recommend Favorite

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

By Mahmudi R. Geranmayeh A. Mahmoodi S. Khalatbari A.

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1071-1078

Springer Publishing Company

Access to resources Recommend Favorite