Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

By Wang Mingna  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 148-155

Springer Publishing Company

Access to resources Recommend Favorite

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

Access to resources Recommend Favorite

Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

By Xia Yanghua   Xie Xiaoming   Xie Xiaoming   Lu Chuanyan  

Journal of Materials Science, Vol. 41, Iss. 8, 2006-04 ,pp. : 2359-2364

Springer Publishing Company

Access to resources Recommend Favorite

Formation of bulk Cu₆Sn₅ intermetallic compounds in Sn–Cu lead-free solders during solidification

By Shen J.   Liu Y.   Gao H.  

Journal of Materials Science, Vol. 42, Iss. 14, 2007-07 ,pp. : 5375-5380

Springer Publishing Company

Access to resources Recommend Favorite

Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

By Shen Jun   Tang Qin   Pu Yayun   Zhai Dajun   Cao Zhongming   Chen Jie  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 12, 2013-12 ,pp. : 4881-4887

Springer Publishing Company

Access to resources Recommend Favorite