Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive

By Yamashita Munenori   Suganuma Katsuaki  

Journal of Materials Science, Vol. 41, Iss. 2, 2006-01 ,pp. : 583-585

Springer Publishing Company

Access to resources Recommend Favorite

Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

By Chan K.   Mariatti M.   Lockman Z.   Sim L.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 8, 2010-08 ,pp. : 772-778

Springer Publishing Company

Access to resources Recommend Favorite

Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin

By Yang Xiaojian  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 108-114

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

By Lu Henry   Balkan Haluk   Ng K.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 3, 2006-03 ,pp. : 171-178

Springer Publishing Company

Access to resources Recommend Favorite

Effect of different types of silver and epoxy systems on the properties of silver/epoxy conductive adhesives

By Khairul Anuar S.   Mariatti M.   Azizan A.   Chee Mang N.   Tham W.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 757-764

Springer Publishing Company

Access to resources Recommend Favorite