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Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

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Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder

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Effect of Bi content on spalling behavior of Sn–Bi–Zn–Ag/Cu interface

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