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Springer Publishing Company

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Fracture behavior of Cu-cored solder joints

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Journal of Materials Science, Vol. 46, Iss. 21, 2011-11 ,pp. : 6897-6903

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Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

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Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

By Kim Doosoo   Chang Jong-hyeon   Park Jungil   Pak James  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 703-716

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Effect of current stressing on the reliability of 63Sn37Pb solder joints

By Wu B.   Chan Y.   Zhong H.   Alam M.  

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