Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

Author： Kim Doosoo Chang Jong-hyeon Park Jungil Pak James

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.22, Iss.7, 2011-07, pp. : 703-716

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

By Yu Chun

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 124-129

Springer Publishing Company

Access to resources Recommend Favorite

Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si₃N₄/Cu Solder Joints

Advanced Materials Research, Vol. 2015, Iss. 1107, 2015-07 ,pp. : 577-581

Trans Tech Publications

Access to resources Recommend Favorite

Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

Springer Publishing Company

Access to resources Recommend Favorite

Characterizing the formation and growth of intermetallic compound in the solder joint

By Lee Y.G. Duh* J.G.

Journal of Materials Science, Vol. 33, Iss. 23, 1998-12 ,pp. : 5569-5572

Springer Publishing Company

Access to resources Recommend Favorite

Effect of anisotropy of tin on thermomechanical behavior of solder joints

By Subramanian K. N. Lee J. G.

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 235-240

Springer Publishing Company

Access to resources Recommend Favorite