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Journal of Materials Science, Vol. 42, Iss. 11, 2007-06 ,pp. : 4076-4086

Springer Publishing Company

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Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 6, 2007-06 ,pp. : 665-670

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The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

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