Interfacial reactions between eutectic Sn–Pb solder and Co substrate

By Wang Chao-hong   Kuo Chun-yi  

Journal of Materials Science, Vol. 46, Iss. 8, 2011-04 ,pp. : 2654-2661

Springer Publishing Company

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Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

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Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

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Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments

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Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 237-246

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In-situ SEM observation on fracture behaviors of Sn-based solder alloys

By Ying Ding   Chunqing Wang   Mingyu Li   Han-Sur Bang  

Journal of Materials Science, Vol. 40, Iss. 8, 2005-04 ,pp. : 1993-2001

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Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

By Kim Dae-Gon   Jang Hyung-Sun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 8, 2005-08 ,pp. : 523-528

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