Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

By Sharif A.   Chan Y.C.   Islam R.A.  

Materials Science and Engineering: B, Vol. 106, Iss. 2, 2004-01 ,pp. : 120-125

Elsevier

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

Springer Publishing Company

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Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

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Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

By Shohji Ikuo   Yoshida Tomohiro   Takahashi Takehiko   Hioki Susumu  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 219-223

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Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

By Wei G.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

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