Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment

By Chen Wen-Xue   Xue Song-Bai   Wang Hui   Hu Yu-Hua  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 8, 2010-08 ,pp. : 779-786

Springer Publishing Company

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The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints

By Zhang Keke   Zhang Xiaojiao   Qiu Ranfeng   Shi Hongxin   Liu Yujie  

Journal of Materials Science: Materials in Electronics, Vol. 25, Iss. 4, 2014-04 ,pp. : 1681-1686

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Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder

By Saud N.   Jalar A.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 10, 2010-10 ,pp. : 1083-1089

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Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

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Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

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