Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging

Author: Lang Fengqun   Nakagawa Hiroshi   Aoyagi Masahiro   Ohashi Hiromichi   Yamaguchi Hiroshi  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.9, 2010-09, pp. : 917-925

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